High-Rigidity Ceramics
(Silicon-Infiltrated Silicon Carbide - SiSiC)
Our high-rigidity ceramics consist of compound materials based on Silicopn Carbide with additional Silicon infiltration.
Our reaction bonding process makes it possible to mold complex hollow shapes.
SiSiC's low outgassing also makes it ideal for use in a vacuum environment.
Sample dimension : 300 × 450 × 50 mm
Reaction Bonding
Applications
- ■ Tables and guide shafts for high-precision positioning systems
- ■ Mirror substrates and its peripherals
- ■ Close examination, parts for inspection systems
Properties
| Material | High-Rigidity Ceramics Si-SiC | Alumina AI2O399.7％ | SiC | Granite |
|---|---|---|---|---|
| CTE ×10-6/℃ | 2.3 | 5.4 | 2.6 | 5.0 |
| Young's Modulus Gpa | 360 | 370 | 400 | 60-100 |
| Bulk Density | 3.0 | 3.9 | 3.1 | 2.9 |
| Specific Rigidity (Young's Modulus / Bulk Density) | 120 | 95 | 129 | 20-35 |
Precision Ceramic Components
Large Ceramics
High-Rigidity Ceramics
(SiSiC)
Electrically Conductive
Ceramics
Low Thermal Expansion Ceramics (Cordierite)